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Customized PC Cooler (B2B)
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Product model : CD0507E

Introduction of product
- Cooling module adapting heat pipes developed and mass produced first in Korea for Tower, Slim-design PC mounted with high heat-generating CPU(Smithfield) of Intel

Product specifications
- Dimensions : 100(L)x94(W)x77(H)mm
- Weight : 350 g
- Heat dissipation device material : Aluminum(A1050)
- Hear dissipating area: 2,360§²
- Heat Pipe : ¦6mm, L218mm, 4EA Application
- Fan : Nidec 92x92x25.4mm Sleeve Bearing
- Fan Speed : 12V, Max. 2300rpm
- Application : Tower, Slim PC
- Applied Board : Intel Socket 775
- Applied CPU : Up to Intel Pentium D(Smithfield) 840
- Supplier : Ssangdeok Electronics èâ

Features of Products
- Heat pipe of superconductivity employed
- Optimizing heat dissipation area
- Customized dimensions(optimized for concerned PC housings)
- Optimized heat dissipation area reduces fan rpm and noise.

Product capabilities
- Cooling Intel Pentium D(Smithfield) 840

Application areas
- Tower, Slim-type PC
 
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APACK. inc 59-6, Hwaam-dong, Yusung-gu, Daejeon: 305-348 KOREA
Copyright 2006 APACK. Inc All rights reserved. TEL : +82-42-864-0815 FAX : +82-42-862-9815