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Customized PC
Cooler (B2B) |
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Introduction of product
- Heat pipe adapted cooling module for cooling Samsung Electronics¡¯
notebook PC mounted with super-slim CPU ( Dothan) of Intel
Product specifications
- Dimensions : 183.7(L)x97.2(W)x0.5t(H)mm
- Weight : 13.7 g
- Heat dissipation device material : Aluminum(A1050P)
- Hear dissipating area : 195§²
- Heat Pipe : ¦3mm, L130mm
- Fan : Non-applied
- Application : Super-slim Notebook PC
- Applied CPU : Intel Ultra Low Voltage P-M Processor
- Supplier : Samsung Electronics
Features of Products
- Heat pipe of superconductivity applied
- Optimizing heat dissipation area
- Customized dimensions(optimized for concerned PC housings)
- Optimized heat dissipation area not requiring fan(noise significantly reduced)
Product capabilities
- Cooling Intel Ultra Low Voltage P-M Processor
Application areas
- Super-slim Notebook PC |
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