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Customized PC
Cooler (B2B) |
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Introduction of product
- Heat pipe adapted cooling module for cooling notebook PC of DELL
(Samsung Electronics OEM) mounted with super-slim CPU( Dothan) of Intel
Product specifications
- Dimensions : 117.6(L)x93.8(W)x0.8t(H)mm
- weight : 26.3 g
- Heat dissipation device material : Aluminum(A1050P)
- hear dissipating area : 169㎠
- Heat Pipe : Ф4mm, L97mm, 1EA Application
- Fan : Non-applied
- Application : Super-slim Notebook PC
- Applied CPU : Intel Ultra Low Voltage P-M Processor
- Supplier : Samsung Electronics
Features of Product
- Heat pipe of superconductivity employed
- Optimizing heat dissipation area
- Customized dimensions(optimized for concerned PC housings)
- Optimized heat dissipation area not requiring fan(noise significantly reduced)
Product capabilities
- Cooling Intel Ultra Low Voltage P-M Processor
Application areas
- Super-slim Notebook PC
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