|
|
|
|
|
 |
|
Customized PC
Cooler (B2B) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
|
| |
Features of Products
- Heat-generating devices such as CPU and RAM located on the front
section of the server cause elevation of temperature, which, in turn,
elevates temperature of the rear CPU exceeding the AMD specifications.
- Heat pipes are installed on the heat sink base to dissipate heat generated
from the rear CPU to the heat sink on the front section for reducing the
temperature of the CPU
- AMD thermally validated solution
Product specifications
- Processor / Cache : Dual mPGA940 ZIF Sockets Supports up to two AMD
Opteron processor(s) Model 250 with 1MB Cache and Integrated
Memory Controller
- Form factor : 1U Rackmount type
Product capabilities
 |
|
|
|
