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Electronics Cooling |
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Vapor Chamber |
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Vapor chamber, the heat exchange system that automatically circulates by the capillary radius naturally accompanied by during phase change of the fluid inside the micro channel, has the basic phase change mechanism of evaporation-> vapor movement -> condensation -> return, which is similar to that of heat pipe.
The micro wick inserted inside can be manufactured in all shapes according to the shape of the cooling system, and provides the merit of low dependency on material. Moreover, with photo etching method that enables the ultra slim plate manufacturing, it is very convenient to apply in slim type electronics.
The evaporation mechanism consists of the heat transfer from the heat source through solid surface, the heat absorption from the thin liquid layer as an evaporation latent heat, and the phase change from liquid to vapor. The cooling agent, after the phase change, is spread to large condensing region through vapor movement passage by the increased pressure in the upper part of the evaporating region without any heat loss.
As for the mechanism of condensation, the vapor flowed in from the vapor passage is condensed to liquid on cold wall surface, and the condensed heat is transferred through solid wall surface and spread to outside. At this time, the condensed liquid has a process of returning to evaporating part through wick by the capillary radius.
Features
Realizes cooling system of less than 2mm thickness
Uses the ultra slim wick to realize slim product
Directly attached to the heat source and minimizes the transfer heat resistance in solid surface
Superior processing and production of wick
Very easy packaging
Performance and improved effects
The CPU cooler commonly used for slim type laptop computer consists of aluminum die-casting, heat pipe and fan, wherein the heat system is constructed by forced convective cooling. Below is the performance comparison between CPU cooler used in the laptop computer manufactured and sold by S company and vapor chamber CPU cooler of the same size.
| Item |
Sub-item |
Heat pipe cooler |
Vapor chamber cooler |
Improvement |
| Thickness (mm) |
Total |
2.5 |
1.8
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| Heat pipe or Vapor chamber |
1.5 |
1.8 |
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| Aluminum base |
1.0 |
0.0 |
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| Heat transfer limit test |
SEPA 6,000rpm(Air cooling) |
14.1W |
21.2W |
+50% |
| FAN attachment test
(Thermal resistance,
กษ/W) |
Total |
3.90 |
2.59 |
+33.5% |
| Evaporator |
0.72 |
0.31 |
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| Adiabatic |
1.24 |
0.16 |
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| Heat sink |
1.94 |
2.12 |
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| Heat transfer limit test |
Cooling region (Water cooling) |
15W |
70W |
+360% |
| Weight (g) |
Excluding Fan |
20.8 |
69 |
-231.7% |
* (+) Positive effect, (-) Negative effect
When applying the vapor chamber to the existing cooling system, the thickness and heat resistance were reducible by 0.7mm and approx. 33.5%, respectively, while the heat transfer limit was greatly enhanced compared to other cooling systems using the existing heat pipe models. However, vapor chamber gained approximately 40g additionally due to copper material used for material fitness of container and working fluid. |
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