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Electronics Cooling
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MEMS
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Features of MEMS Cooing Module
CPL (Capillary Pumped Loop) Type
Heat capacity of max. 25W/§²
Thickness min. 1.8 mm
Groove of evaporator part: Width 100 ¥ìm, Depth 200 ¥ìm

Applications of MEMS Cooing Module
Cooling of PDA & Mobile Phone
Cooling of Micro Electronic Devices


MEMS : Micro Electro Mechanical System
 
 
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APACK. inc 59-6, Hwaam-dong, Yusung-gu, Daejeon: 305-348 KOREA
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